ECTC 2025 4th Day: Highlights Substrates, Thermal Management and 3D Packaging

ECTC 2025 4th Day: Highlights Substrates, Thermal Management and 3D Packaging

Microelectronics Agenda concludes ECTC participation with a strategic vision for the future of the sector

At the close of the 75th edition of the Electronic Components and Technology Conference (ECTC), the Microelectronics Agenda, represented by AIDA CCI, once again stood out as a strategic instrument for affirming Portugal’s role in the global semiconductor value chain.

Participation on the final day of the conference was marked by a high-level technical focus, with emphasis on areas directly aligned with the Agenda’s objectives, namely heterogeneous integration, advanced substrates, hybrid bonding and new interconnect solutions — all essential topics for national development in Packaging & Test.

Among the most relevant sessions, the following stood out:
🔹 “Advanced Substrate Technologies – Organic, Embedding and Glass”
A session dedicated to innovation in substrates, a cornerstone of future generations of electronic circuits, including advanced materials and integration of new functionalities.

🔹 “Thermal Management and Material Solutions for High-Performance 2.5D and 3D Packaging”
Fundamental discussions on thermal solutions and innovative materials enabling the development of higher density, high-performance devices, with direct impact on the automotive, telecommunications and AI industries.

🔹 “Innovative Interconnects and Through Via Technology for 3D Packaging”
Presentations focused on miniaturization, reliability and efficient integration of electronic components — strategic topics for Agenda members.

🔹 “Modeling Driven Packaging and Process Advancements”
An approach centered on manufacturing process modelling and design optimization, highly relevant for the transition from R&D to industrial production.

These sessions reinforced the need to position the Microelectronics Agenda not just as a national technological capacity-building project, but also as a platform linking advanced knowledge, industry and global supply chains.

The Microelectronics Agenda, supported by the PRR – Recovery and Resilience Plan and the European Union’s NextGenerationEU funds, brings together leading companies and R&D centers working daily to secure the future of microelectronics in Portugal, promoting applied innovation, industrial investment and internationalization of the sector.

“The presence of the Microelectronics Agenda at ECTC 2025 is a clear sign of the growing maturity of the Portuguese ecosystem and its ability to engage with global industry leaders. The future lies in specialization in areas such as packaging, advanced substrates and 3D interconnects – and Portugal has a strategic opportunity that must not be missed,” emphasizes Elisabete Rita, General Director of AIDA CCI.

Participation in one of the sector’s largest technical events reinforces the Agenda’s ambition to establish Portugal as a competitive and sustainable destination for investment and development in semiconductors and associated technologies.

The Microelectronics Agenda has a total eligible budget of €67,493,749.21, of which €30,048,411.91 is financed by the NextGenerationEU initiative. With project completion scheduled for June 30, 2025, Portugal aims to position itself as a leader in the global semiconductor sector, having already made significant progress in product development, processes, sustainability and workforce training.

Learn more about the Microelectronics Agenda.

News source for Day 4 of ECTC 2025: Microelectronics Agenda in the spotlight at ECTC 2025